As a semiconductor memory manufacturer, Hynix has firmed its core business competency and secured solid competitive advantages in the industry. The Company has also secured competency for the future by focusing on R&D and marketing capability.

Hynix has strengthened its status as a leading semiconductor company in many regions including China which is now the biggest semiconductor market in the world. The Company is building internal corporate competency by improving its financial stability and managing risks for sustainable growth.

Hynix aims to become a ‘Long-lasting, Great company as the best memory solution provider’, the purpose of which is to provide our customers, shareholders, society, and our employees with the best satisfaction and the utmost value, through a sustained improvement in quality. Hynix will remain committed to providing the best products and service

With its large wafer production capacity, technological innovation in manufacturing and process, and the pursuit of the highest quality, Hynix is now leading industry efforts to develop next generation DRAM products. Significant investments in R&D has given Hynix a head start in the development of very high density DRAMs in small packages that enable the design of unique end-use applications. Currently, Hynix offers a full range of products from 4M to 1Gb with DDR, DDR2 and DDR3 interfaces. A family of Graphic DRAMs(GDDR3 and GDDR4) are also available. Hynix also offers low-power DRAM products optimized for use in mobile applications such as cell phones.

Hynix also offers a wide range of memory modules for PCs, notebooks and servers. Through its global manufacturing and sales support network, Hynix has emerged as a leading DRAM supplier to major OEMs worldwide. Hynix plans to continue its industry leading development of new products and technologies to meet industry requirements.