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Winbond

Winbond distributor|Winbond vendor

Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan and has been publicly traded on the Taiwan Stock Exchange (stock code: 2344) since 1995. Winbond owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the developments of four main product lines, including μC & μC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.

Winbond has been striving in the field of Computer Logic ICs for years and holds a high market share of the Motherboard I/O controllers. We continually launched more products, like TPM (Trusted Platform Module) and Sideshow controller, etc., to meet the diversified application requirements of the computer systems.  The μC & μC-based Consumer ICs focus on the product design of consumer ICs, speech ICs, and multimedia ICs embracing the core value of innovation. As to Mobile RAM, Winbond not only introduced a series of SDRAM with the sizes of 64Mb, 128Mb, and 256Mb but also developed high-density, low-power, high-speed, and cost effective Pseudo SRAM to complete the product line and integrate itself into the fast growing market. Flash Memory is dedicated to low to medium density NOR Flash memory products; the complete product allocation on both Parallel Flash and Serial Flash along with the development of manufacturing process make the flash products more competitive in the market.

Winbond has over 5,000 employees worldwide and operates a 150mm wafer fab, two 200mm wafer fabs (*), and a 300mm wafer fab. In line with Winbond抯 valuing of its long-term relationships with its partners and customers, Winbond has set up subsidiaries in the USA, China, Israel, and Japan to strengthen the regional customer support and global management. Winbond, with the collaboration of its experienced and intelligent team, owns more than 2,500 patents worldwide. Professionalism and innovation are the main goals that we are pursuing. In order to improve the yield rates, supply chain management, and customer satisfaction, Winbond implements a high standard manufacturing process control and quality control system, and thereby has been accredited by IECQ, ISO 9001, ISO 14001 and QS 9000.

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